Hosokawa Yoko Co., Ltd. will jointly exhibit with our group company, Cheer Pack North America LLC (CPNA), at PACK EXPO^® International 2026.

PACK EXPO^® International is one of the largest packaging and processing technology trade shows in North America.

Dates: October 18 (Sun)- October 21 (Wed), 2026
Venue: McCormick Place (Chicago, IL, U.S.A.)
Booth No.: N-5960

For more information, please click here.

We sincerely look forward to welcoming you to our booth.